電漿蝕刻

等離子體蝕刻涉及對選定的氣體混合物進行射頻激勵,以產生具有正確反應性物種的等離子體,以蝕刻晶圓表面上任何未掩蓋的區域。反應形成揮發性副產物,其通過真空泵抽除去。

Omega® 蝕刻系統

SPTS為各種應用提供先進的蝕刻技術

Omega® Rapier / DSi / DSi-v

Omega® Rapier / DSi / DSi-v

With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...

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Omega® ICP

Omega® ICP

SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and...

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Omega® Synapse™

Omega® Synapse™

Omega® Synapse™ etch process module uses a high density plasma source and is designed to etch strongly bonded...

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