SPTS was the original Bosch Process licensee in 1994, shipping the first commercial system in the following year. Since that time, we have continuously improved DRIE process capability, and last month the company shipped its 1000th DRIE system.  For more details, click here

Plasma dicing can offer many advantages over traditional blade dicing, reducing die damage and lost "real estate", while increasing throughput and die shape flexibility. Click here to see more....

SPTS offers a unique & patented “parameter ramping” technology, using its Morflex^TM software, which allows continuous adjustment of the plasma conditions to maintain etch rate and a smooth sidewall profile for deep silicon etching.

SPTS has developed low temperature PECVD processes specifically for passivation of post-reveal TSVs.  High quality films, which importantly maintain stable electrical properties over time, can be deposited on bonded wafers with their inherent temperature limits, and problems caused by degassing.  To see how SPTS addresses these issues click here....