Plasma dicing can offer many advantages over traditional blade dicing, reducing die damage and lost "real estate", while increasing throughput and die shape flexibility. Click here to see more....
SPTS offers a unique & patented “parameter ramping” technology, using its MorflexTM software, which allows continuous adjustment of the plasma conditions to maintain etch rate and a smooth sidewall profile for deep silicon etching.
SPTS has developed low temperature PECVD processes specifically for passivation of post-reveal TSVs. High quality films, which importantly maintain stable electrical properties over time, can be deposited on bonded wafers with their inherent temperature limits, and problems caused by degassing. To see how SPTS addresses these issues click here....
SPTS is attending the following exhibitions and conferences in 2013:
Introduction to SPTS Technologies
Dr. Dave Thomas discusses SPTS' via reveal technologies at ECTC 2012
SPTS is exhibiting at CS Mantech 2013, to be held in New Orleans, 13-16 May.
SPTS is sponsoring the MEMS Forum, and participating in the 2.5D/3D IC Forum at SEMICON Singapore 2013.
For more details, go to http://www.semiconsingapore.org
SPTS Technologies is a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry.