R&D Projects

SPTS provides advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions. Through an ongoing program of research and development and collaborative development with customers and industry consortia, SPTS is able to contribute to the advancement of the global semiconductor industry.

We understand the requirement for collaboration in order to propel industry advancements and opportunities, and we work with a number of leading research institutes around the world, including: imec (Belgium), Fraunhofer IZM (German), CEA-Leti (France), IME / A*STAR (Singapore), Swansea University  (UK), and Cardiff University (UK).

The following are some examples of SPTS's collaborative R&D projects.

     
 

3D-IC

In 2015, SPTS and imec began developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.

Read more: Imec and SPTS Technologies Collaborate on Critical Processes for 3D IC Wafer Stacking

Initial results of this work were published in a paper at ECTC2016 and can be downloaded here.

     
     
   

3D-TSV

In 2014, SPTS and CEA-Leti in Grenoble, France, entered an agreement to develop 3D-TSV technologies. The agreement builds on the long established relationship between the partners who have already collaborated in the past, particularly on the development and optimization of an advanced MOCVD TiN barrier for high aspect ratio TSV. 

Read more: SPTS Technologies and CEA-Leti and Nanoelec RTI collaborate on 3D-TSV Technology

     
     
 

Bio MEMS

In 2013, SPTS and imec, a world-leading nanoelectronics research center  announced a joint partnership to further advance micro- and nanosized components for BioMEMS, using SPTS’ Rapier silicon deep reactive ion etching (Si DRIE) technology.

http://www.analog-eetimes.com/news/imec-spts-team-biomems

     
     
 

eRAMP 

eRAMP, lead by Infineon, includes 26 research partners from six countries. Including companies such as, Robert Bosch GmbH (Stuttgart, Germany), SGS INSTITUT FRESENIUS (Taunusstein, Germany), Siemens AG (Berlin, Munich), and many more. 

http://www.infineon.com/cms/en/product/promopages/eramp/

The objective of the three-year project “eRamp” is to strengthen and expand Germany and Europe as centers of expertise for the manufacture of power electronics. 

April 2014 - April 2017

     
     
 

A* IME High Density FOWLP Consortium

A*STAR’s Institute of Microelectronics (IME), together with Amkor Technologies, NANIUM S.A, STATS ChipPAC, NXP Semiconductors, GLOBALFOUNDRIES, Kulicke & Soffa, Applied Materials, Inc., Dipsol Chemicals, JSR Corporation, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

 

Click here to read more

     
     

 

InForMed

The InforMed project represents an investment of >€58 million. Led by Philps Electronics Nederlands it involved 39 different companies from 10 countries including SPTS, Micronit, Okmetic, Ipdia, Fraunhofer and others.  InForMed is an ECSEL JU project and is co-funded by grants from Belgium, Finland, France, Germany, Great Britain, Ireland, the Netherlands, Spain, Sweden and Switzerland.

http://informed-project.eu/

InForMed will establish a pilot line for micro-fabricated medical devices that:

  • encompasses the complete trajectory from micro-fabrication to assembly and “smart catheter” fabrication.
  • brings together key industrial and academic players in a manufacturing ecosystem
  • enables optimal use of European technologies and competencies.

The pilot line will be demonstrated by a number of innovative products for hospital and home healthcare.

June 2015 - June 2018

     
     
     

A* IME MEMS III Consortium

A*STAR’s Institute of Microelectronics (IME) has launched its third consortium to develop cutting-edge micro-electro-mechanical systems (MEMS) technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and smaller form factor.  

https://www.a-star.edu.sg/ime/INDUSTRY/INDUSTRY-CONSORTIA.aspx

The MEMS Consortium III comprises leading industry members Applied Materials, Coventor, Delta Electronics, GLOBALFOUNDRIES, InvenSense, SPTS Technologies, Standing Egg, ULVAC, Inc., Veeco and an electronics company. It will draw on IME’s expertise in MEMS sensors and process platform capabilities to develop industrial-grade inertial sensors and pressure sensors for adoption into a wide range of products and applications, such as electronic stability control, asset tracking, unmanned aerial vehicles, automotive and wearable devices. To achieve this, they will focus on bridging the gaps in performance, cost and size between existing industrial-grade inertial sensors and current MEMS sensors. 

June 8th 2016

     
     

  

  Microneedles

SPTS has a partnership with Swansea University’s School of Engineering and Medicine and Cardiff University coordinated by the UK Technology Strategy Board in 2010 to commercialise tiny (micro and nano) devices in healthcare, communications and solar projects.

More Information Available here

“Our project with Swansea University exposes us to new markets, technologists and other industries, such as pharmaceuticals.” Huma Ashraf, Process Manager (R&D Accounts), SPTS Technologies

November 2014 - May 2017

     
     

 

 PowerBase

The project PowerBase receives funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) under grant agreement No 662133. Coordinated by Infineon Tech. Austria the project involves 39 partners from 9 countries such as EpiGaN, Siltronic, Plansee and SPTS. 

http://www.powerbase-project.eu/project-work.html

The Innovation Action (IA) project “PowerBase” will follow a holistic vertical approach from material research across the entire value chain to advanced systems and aims to provide significant impact to essential technologies and key applications.

May 2015 - May 2018

     
     

 

 

Recently Completed Projects 

     
EPPL   EPPL  

The EPPL project received a total funding of 178k Euro. It included the involvement of companies such as AMS, Infineon, CEA Leti and SPTS. 

http://www.eppl-project.eu/impact/

EPPL's main goal was to extend the leading position of power semiconductors “Made in Europe”. The expected improvements address both technical challenges and commercial competitiveness, in technology research, semiconductor manufacturing, chip/package interconnection technologies and energy efficient applications.

April 2013 - April 2016

     
     

 

MASTER 3D
MAnufacturing Solutions Targeting competitive European pRoduction in 3D

Within Master 3D, SPTS Technologies, in collaboration with all the project partners (including, STMicro, Infineon, NXPams and others) proposed a Cost of Ownership (CoO) model and benefits for both via-middle and via-last packaging process flows. With CEA-LETI, SPTS demonstrated and characterized a CVD TiN  barrier layer deposition with excellent step coverage & electrical characterization on High Aspect Ratio TSV (up to 20:1) and demonstrated CoO benefits compared to conventional PVD methods. SPTS also worked with STMicro on the process development of Via-middle etching with 10:1 aspect ratio (10 µm vias / 100 µm deep) and achieved a high etching rate of >8 µm/min.

December 2012- December 2015

 

Click here to view the poster, presented at the Nanoelectronik Forum in Berlin 2015 

 
 
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