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Products

Available on a range of wafer handling platforms, SPTS supplies etch, deposition and thermal systems for volume production, R&D or pilot production environments. Served markets include MEMS, LEDs, advanced packaging, power semiconductors, and high speed RF IC.

Technologies offered

Single Wafer Platforms

SPTS' ICP, DRIE, PECVD, PVD and MOCVD modules are available on 3 wafer handling platforms:

  • fxP® - 100 to 300mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • i2L® - 3" to 200mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • LPX - 3" to 200mm wafer size. Supports Etch & PECVD modules only

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