Products

Available on a range of wafer handling platforms, SPTS supplies etch and deposition wafer processing systems for volume production, R&D or pilot production environments. Served markets include Advanced Packaging, MEMS, LEDs, Power Semiconductors, and High Speed RF-ICs.

Technologies and Process Solutions offered include:

 

Single Wafer Platforms

SPTS's ICP, DRIE, PECVD, PVD and MOCVD modules are available on 3 wafer handling platforms:

  • fxP® - 100 to 300mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • c2L® - 3" to 200mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • LPX - 3" to 200mm wafer size. Supports Etch & PECVD modules only

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