Presentations

Below is a list of presentations which SPTS has presented at various technical and industry conferences in recent years.

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Presentations

  1. "The lower Cost of Ownership Route to Thinner/Smaller/Stronger Die" R. Barnett (Yole Dev. Tech Symposium 2017)
  2. "Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die" R. Barnett (SEMICON SEA 2017)
  3. "How Plasma Dicing is Becoming Mainstream" D Butler (SEMI European 3D Summit 2017)
  4. "Extreme Wafer Thinning to 5μm for Low Cost Via-Last" D. Thomas (SPTS/imec joint paper at 3D-ASIP 2016)
  5. "How Plasma Dicing is Finally Becoming Mainstream" R. Barnett (Be-Flexible 2016)
  6. "High Productivity UBM/RDL Deposition By PVD For FOWLP Applications" C.Jones (IWLPC 2016)
  7. "Plasma Dicing: More Die, Stronger Die" R. Barnett (SEMICON Taiwan 2016)
  8. "Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS" N. Knight (SEMICON Taiwan 2016)
  9. "Deep Silicon Etching - Increasingly Relevant > 20 years on!" D. Thomas et al (ECS 2016)
  10. "FOWLP Goes Mainstream. PVD Solutions For The Fastest Growing Packaging Format" D. Butler (3D Summit 2016) 
  11. "More Die, Stronger Die. Smaller, Thinner, Packages Drives Die Singulation by Plasma Etch" D. Butler (3D ASIP 2015)
  12. "Impact of Backside Processing on C-V Characteristics of TSV Capacitors in 3D stacked IC Process flows" D. Thomas et al; SPTS/imec joint paper (EPTC 2015)
  13. "Improving device yields and throughput using plasma dicing" R. Barnett et al (IWLPC 2015)
  14. "Comparison between wet and dry silicon via reveal in 3D backside processing" D. Thomas et al; SPTS/imec joint presentation (IWLPC 2015)
  15. "Aluminium Nitride Piezoelectric Technology for Next Generation MEMS" D Butler (MEMS Manufacturing 2015)
  16. "High Density Packaging on Wafer Level Fan-out: Deposition and Via Drilling Solutions Tailored for Non-Silicon Substrates" D Butler (SEMI European 3D-TSV Summit, Grenoble, Jan 2015)
  17. "‘Evolution or Revolution? Process Solutions for Next Generation MEMS’" D. Thomas (SEMI MEMS Technical Seminar, Milan Sept 2014)
  18. "Advanced Packaging" K. Buchanan (SEMICON Russia 2014; Advanced Packaging Session 2014)
  19. "PECVD Below 200 Degrees C: Emerging Applications in MEMS" D. Butler (MEMS 2012)
  20. "SPTS Etch Update Prepared for CS Mantech" D. Thomas (CS Mantech 2012)
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