Molecular Vapor Deposition (MVD®) was invented to help semiconductor manufacturers grow ultra-thin, functionalized, organic and inorganic films with higher yields and better cost efficiencies than traditional liquid deposition techniques. Such films serve as lubricant, protective, hydrophobic, hydrophilic, biocompatible, or reactive coatings. In MEMS applications, for example, MVD-films are typically used as anti-stiction coatings to improve device performance, and enhance overall device lifetime.

MVD process technology deposits ultra-thin films by vapor deposition at low temperatures on a broad spectrum of substrates. It’s the only deposition technology of its kind. A highly flexible system that can run both ALD-like and CVD-like processes, the platforms feature optional integrated plasma generation for substrate conditioning. MVD platforms allow for the use of up to four precursors, and can process multiple wafers or other three-dimensional objects in a single batch. It delivers extremely high conformality on aggressive aspect ratios of up to 2000:1.

Benefits of MVD® for MEMS Production

  • Low temperature (<150°C) deposition
  • Flexible
  • Low CoO, batch process
  • Improved device reliability
    • Anti-stiction, bio–functionalization, and common ALD dielectric films 
    • Moisture/oxidation barriers and encapsulation for advanced packaging
  • >15B MEMS devices have been built using MVD® technology

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