LPCVD/Diffusion for Advanced Packaging

SPTS’s large batch vertical furnace products offer low temperature anneal solutions ideally suited to high-volume advanced packaging applications.

Benefits of SPTS LPCVD/Diffusion for Advanced Packaging:

  • Thermal processes for interposer TSV
  • Wet thermal oxide for Si via liner with high conformity and oxide integrity
  • Low temperature metal anneals with excellent control of sheet resistance (Rs) and low CoO
  • High yield anneals for e-WLB
  • Controlled film shrinkage and bow
  • Low O2 environment prevents Al or Cu oxidation

Related Product Information

LPCVD Product Information