LPCVD/Diffusion for Advanced Packaging
SPTS’s large batch vertical furnace products offer low temperature anneal solutions ideally suited to high-volume advanced packaging applications.
Benefits of SPTS LPCVD/Diffusion for Advanced Packaging:
- Thermal processes for interposer TSV
- Wet thermal oxide for Si via liner with high conformity and oxide integrity
- Low temperature metal anneals with excellent control of sheet resistance (Rs) and low CoO
- High yield anneals for e-WLB
- Controlled film shrinkage and bow
- Low O2 environment prevents Al or Cu oxidation