Thick Poly-Si for MEMS
SPT’s Advanced Vertical Processor (AVP) has been designed to deposit doped and un-doped polysilicon films >4μm thick without wafer stickingDownload
SPTS’s AVP/RVP large batch thermal process system delivers flexible, low cost, solutions that enable a simple transition from pilot to high volume production.
SPT's LPCVD SiN process that combines the excellent stress control and process repeatability of a PECVD process together with the benefits of low wet etch rate and low ownership cost of an LPCVD systemDownload
Surface transformation to remove the "scallops", created by silicon DRIE during MEMS manufacturing, can be achieved by annealing the Si wafers at high temperature (~1100°C) in a H2 ambient in SPT's RVP furnace.Download
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