The Delta APM is widely used in production for RF-IC semiconductor applications. SPTS develops processes and hardware for smaller wafer sizes for today’s production needs with extendibility to larger wafer sizes, without the need for new hardware. Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment
Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers.
Benefits of SPTS PECVD for Compound Semiconductor RF-IC
One chamber for all wafer sizes
Industry-leading uniformity and repeatability
SiN with proven reliability for MIM capacitors
High deposition rate SiN with tuneable stress for passivation
TEOS-based SiO for enhanced step coverage
Low H SiN films
Related Product Information
Plasma Processes for Compound Semiconductors
Overview of the plasma processing technologies which SPTS offers for a variety of Compound Semiconductor applications such as RF, Power and Opto-electronic device manufacturing.
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