High productivity PVD for UBM/RDL metallization in FOWLP and other applications
With the adoption of organic passivation and new substrate materials the technical challenges for UBM/RDL deposition are in the areas of pre-treatment.
Using novel degas and pre-clean technology, the Sigma® fxP produces consistently low Rc values whilst delivering a 2x throughput advantage over other PVD tools.
Copper barrier/seed deposition with excellent step coverage in high aspect ratio through silicon vias
SPTS' Advanced Hi-Fill Ionized PVD source delivers world class step coverage for PVD Cu barrier/seed in high aspect ratio features. SPTS also offers extendibility beyond PVD for TSV Cu barrier seed with its C3M MOCVD product range - with the ability to deposit highly conformal metal films at low temperatures required for bonded substrate processing.
Related Product Information
FOWLP - PVD Processes
Download this datasheet describing how fan-out wafer-level packaging (FOWLP) technology provides higher integration levels and a greater number of external contacts.
Download this datasheet describing PVD solutions to deposit Under Bump Metallization (UBM) layers, to enable bump metals to adhere to die electrical pad contacts, or to act as seeds for Cu plated Re-Distribution Layers (RDL).
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