PVD for Advanced Packaging

High productivity PVD for UBM/RDL metallization in FOWLP and other applications

With the adoption of organic passivation and new substrate materials the technical challenges for UBM/RDL deposition are in the areas of pre-treatment. This is becoming yet more challenging as line/space widths and critical dimensions reduce to improve device performance and reduce form factor of the die.

Using patented high vacuum degas and low damage pre-clean technology, the Sigma® fxP produces low and stable Rc values whilst delivering up to a 2x throughput advantage over other PVD systems.

Copper barrier/seed deposition for through silicon vias

SPTS' Advanced Hi-Fill ionized PVD source delivers world class step coverage for PVD Cu barrier/seed in TSVs with aspect ratios of up to 10:1, covering "via-last" TSV schemes.  

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